{"product_id":"laser-solder-ball-jetting-system-laser-tin-ball","title":"Laser Solder Ball Jetting System (Laser Tin Ball)","description":"\u003ch2 data-section-id=\"1iht69n\" data-start=\"1144\" data-end=\"1167\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1147\" data-end=\"1167\"\u003eKey Applications for Laser Solder Ball Jetting\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cul data-start=\"1168\" data-end=\"1332\"\u003e\n\u003cli data-section-id=\"1vjg50w\" data-start=\"1168\" data-end=\"1199\"\u003eBGA soldering and reballing\u003c\/li\u003e\n\u003cli data-section-id=\"1v9f04r\" data-start=\"1200\" data-end=\"1225\"\u003eWafer-level packaging\u003c\/li\u003e\n\u003cli data-section-id=\"b10piy\" data-start=\"1226\" data-end=\"1267\"\u003eSemiconductor device interconnections\u003c\/li\u003e\n\u003cli data-section-id=\"u8xw8s\" data-start=\"1268\" data-end=\"1297\"\u003eSensor and MEMS packaging\u003c\/li\u003e\n\u003cli data-section-id=\"dl5rx9\" data-start=\"1298\" data-end=\"1332\"\u003eAdvanced packaging (2.5D \/ 3D)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2 data-section-id=\"1xv0iiy\" data-start=\"1339\" data-end=\"1360\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1342\" data-end=\"1360\"\u003eKey Advantages of Laser Solder Ball Jetting System\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp data-start=\"1362\" data-end=\"1505\"\u003e\u003cstrong data-start=\"1362\" data-end=\"1387\"\u003eMicro-Scale Precision\u003c\/strong\u003e\u003cbr data-start=\"1387\" data-end=\"1390\"\u003eHandles solder ball sizes from ~70 µm and above for fine-pitch applications\u003c\/p\u003e\n\u003cp data-start=\"1507\" data-end=\"1592\"\u003e\u003cstrong data-start=\"1507\" data-end=\"1530\"\u003eNon-Contact Process\u003c\/strong\u003e\u003cbr data-start=\"1530\" data-end=\"1533\"\u003eNo mechanical force → eliminates risk of component damage\u003c\/p\u003e\n\u003cp data-start=\"1594\" data-end=\"1681\"\u003e\u003cstrong data-start=\"1594\" data-end=\"1620\"\u003eMinimal Thermal Impact\u003c\/strong\u003e\u003cbr data-start=\"1620\" data-end=\"1623\"\u003eLaser-controlled heating protects surrounding structures\u003c\/p\u003e\n\u003cp data-start=\"1683\" data-end=\"1817\"\u003e\u003cstrong data-start=\"1683\" data-end=\"1707\"\u003eFlux-Free Capability\u003c\/strong\u003e\u003cbr data-start=\"1707\" data-end=\"1710\"\u003eClean joints with minimal residue for high-reliability applications\u003c\/p\u003e\n\u003cp data-start=\"1819\" data-end=\"1903\"\u003e\u003cstrong data-start=\"1819\" data-end=\"1839\"\u003eHigh Consistency\u003c\/strong\u003e\u003cbr data-start=\"1839\" data-end=\"1842\"\u003eStable solder ball placement and repeatable joint formation\u003c\/p\u003e\n\u003ch2 data-section-id=\"1xhooa5\" data-start=\"1910\" data-end=\"1933\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1913\" data-end=\"1933\"\u003eProcess Overview for Laser Solder Ball Soldering\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003col data-start=\"1934\" data-end=\"2060\"\u003e\n\u003cli data-section-id=\"7dmf3e\" data-start=\"1934\" data-end=\"1974\"\u003eSolder ball feeding and positioning\u003c\/li\u003e\n\u003cli data-section-id=\"mftrgl\" data-start=\"1975\" data-end=\"2004\"\u003ePrecision ball placement\u003c\/li\u003e\n\u003cli data-section-id=\"10us2l3\" data-start=\"2005\" data-end=\"2032\"\u003eLaser reflow soldering\u003c\/li\u003e\n\u003cli data-section-id=\"dm8w5\" data-start=\"2033\" data-end=\"2060\"\u003eCooling and inspection\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch2 data-section-id=\"192z2h3\" data-start=\"2067\" data-end=\"2089\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"2070\" data-end=\"2089\"\u003eSystem Features\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cul data-start=\"2090\" data-end=\"2331\"\u003e\n\u003cli data-section-id=\"17bfqft\" data-start=\"2090\" data-end=\"2130\"\u003ePrecision solder ball feeding system\u003c\/li\u003e\n\u003cli data-section-id=\"1f38oxv\" data-start=\"2131\" data-end=\"2155\"\u003eLaser reflow control\u003c\/li\u003e\n\u003cli data-section-id=\"6d5i9l\" data-start=\"2156\" data-end=\"2194\"\u003eVision alignment system (optional)\u003c\/li\u003e\n\u003cli data-section-id=\"1cszb40\" data-start=\"2195\" data-end=\"2230\"\u003eClosed-loop temperature control\u003c\/li\u003e\n\u003cli data-section-id=\"12pa6l8\" data-start=\"2231\" data-end=\"2265\"\u003eHigh-precision motion platform\u003c\/li\u003e\n\u003cli data-section-id=\"18egc4x\" data-start=\"2266\" data-end=\"2302\"\u003eIntegrated inspection capability\u003c\/li\u003e\n\u003cli data-section-id=\"tdrgd0\" data-start=\"2303\" data-end=\"2331\"\u003eMES \/ traceability ready\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2 data-section-id=\"jir2xr\" data-start=\"2338\" data-end=\"2399\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"2341\" data-end=\"2399\"\u003eFlexible Configuration: Standalone or Fully Integrated\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp data-start=\"2401\" data-end=\"2467\"\u003eThe system is designed to scale with your production requirements:\u003c\/p\u003e\n\u003cp data-start=\"2469\" data-end=\"2561\"\u003e\u003cstrong data-start=\"2469\" data-end=\"2495\"\u003eStandalone Workstation\u003c\/strong\u003e\u003cbr data-start=\"2495\" data-end=\"2498\"\u003eIdeal for R\u0026amp;D, prototyping, and low-volume advanced packaging\u003c\/p\u003e\n\u003cp data-start=\"2563\" data-end=\"2657\"\u003e\u003cstrong data-start=\"2563\" data-end=\"2585\"\u003eInline Integration\u003c\/strong\u003e\u003cbr data-start=\"2585\" data-end=\"2588\"\u003eSupports high-volume semiconductor and electronics production lines\u003c\/p\u003e\n\u003cp data-start=\"2659\" data-end=\"2765\"\u003e\u003cstrong data-start=\"2659\" data-end=\"2680\"\u003eCustomised System\u003c\/strong\u003e\u003cbr data-start=\"2680\" data-end=\"2683\"\u003eConfigurable for wafer handling, multi-head setups, and specialised applications\u003c\/p\u003e\n\u003ch2 data-section-id=\"yt1sj7\" data-start=\"2772\" data-end=\"2818\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"2775\" data-end=\"2801\"\u003eTypical Specifications\u003c\/strong\u003e \u003cem data-start=\"2802\" data-end=\"2818\"\u003e(Customisable)\u003c\/em\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cdiv class=\"TyagGW_tableContainer\"\u003e\n\u003cdiv class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\"\u003e\n\u003ctable data-start=\"2820\" data-end=\"3156\" class=\"w-fit min-w-(--thread-content-width)\"\u003e\n\u003cthead data-start=\"2820\" data-end=\"2849\"\u003e\n\u003ctr data-start=\"2820\" data-end=\"2849\"\u003e\n\u003cth data-start=\"2820\" data-end=\"2832\" data-col-size=\"sm\" class=\"\"\u003e\n\u003ch3\u003ePerformance Parameters\u003c\/h3\u003e\n\u003c\/th\u003e\n\u003cth data-start=\"2832\" data-end=\"2849\" data-col-size=\"sm\" class=\"\"\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody data-start=\"2877\" data-end=\"3156\"\u003e\n\u003ctr data-start=\"2877\" data-end=\"2930\"\u003e\n\u003ctd data-start=\"2877\" data-end=\"2892\" data-col-size=\"sm\"\u003eProcess Type\u003c\/td\u003e\n\u003ctd data-start=\"2892\" data-end=\"2930\" data-col-size=\"sm\"\u003eSolder Ball Jetting + Laser Reflow\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"2931\" data-end=\"2966\"\u003e\n\u003ctd data-start=\"2931\" data-end=\"2949\" data-col-size=\"sm\"\u003eBall Size Range\u003c\/td\u003e\n\u003ctd data-start=\"2949\" data-end=\"2966\" data-col-size=\"sm\"\u003e~70 – 2000 µm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"2967\" data-end=\"3007\"\u003e\n\u003ctd data-start=\"2967\" data-end=\"2990\" data-col-size=\"sm\"\u003ePositioning Accuracy\u003c\/td\u003e\n\u003ctd data-start=\"2990\" data-end=\"3007\" data-col-size=\"sm\"\u003e±10 µm (typ.)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"3008\" data-end=\"3040\"\u003e\n\u003ctd data-start=\"3008\" data-end=\"3024\" data-col-size=\"sm\"\u003eRepeatability\u003c\/td\u003e\n\u003ctd data-start=\"3024\" data-end=\"3040\" data-col-size=\"sm\"\u003e±5 µm (typ.)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"3041\" data-end=\"3078\"\u003e\n\u003ctd data-start=\"3041\" data-end=\"3063\" data-col-size=\"sm\"\u003eTemperature Control\u003c\/td\u003e\n\u003ctd data-start=\"3063\" data-end=\"3078\" data-col-size=\"sm\"\u003eClosed-loop\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"3079\" data-end=\"3116\"\u003e\n\u003ctd data-start=\"3079\" data-end=\"3093\" data-col-size=\"sm\"\u003eIntegration\u003c\/td\u003e\n\u003ctd data-start=\"3093\" data-end=\"3116\" data-col-size=\"sm\"\u003eStandalone \/ Inline\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr data-start=\"3117\" data-end=\"3156\"\u003e\n\u003ctd data-start=\"3117\" data-end=\"3130\" data-col-size=\"sm\"\u003eInspection\u003c\/td\u003e\n\u003ctd data-start=\"3130\" data-end=\"3156\" data-col-size=\"sm\"\u003eOptional vision system\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003chr data-start=\"3158\" data-end=\"3161\"\u003e\n\u003ch2 data-section-id=\"zlqq2t\" data-start=\"3163\" data-end=\"3199\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"3166\" data-end=\"3199\"\u003eWhy Laser Solder Ball Jetting\u003c\/strong\u003e\u003c\/span\u003e\u003c\/h2\u003e\n\u003cul data-start=\"3201\" data-end=\"3361\"\u003e\n\u003cli data-section-id=\"1bdg73\" data-start=\"3201\" data-end=\"3234\"\u003ePrecise solder volume control\u003c\/li\u003e\n\u003cli data-section-id=\"1xoubj5\" data-start=\"3235\" data-end=\"3272\"\u003eNo contact → no mechanical stress\u003c\/li\u003e\n\u003cli data-section-id=\"17uum5q\" data-start=\"3273\" data-end=\"3308\"\u003eClean process → minimal residue\u003c\/li\u003e\n\u003cli data-section-id=\"1mucqf3\" data-start=\"3309\" data-end=\"3361\"\u003eHigh repeatability → semiconductor-grade quality\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3 data-start=\"3363\" data-end=\"3390\"\u003e👉 Especially critical for:\u003c\/h3\u003e\n\u003cul data-start=\"3391\" data-end=\"3477\"\u003e\n\u003cli data-section-id=\"p284ev\" data-start=\"3391\" data-end=\"3423\"\u003eBGA and fine-pitch packaging\u003c\/li\u003e\n\u003cli data-section-id=\"p284ev\" data-start=\"3391\" data-end=\"3423\"\u003eBGA rework\u003c\/li\u003e\n\u003cli data-section-id=\"f338a1\" data-start=\"3424\" data-end=\"3449\"\u003eWafer-level processes\u003c\/li\u003e\n\u003cli data-section-id=\"nnth54\" data-start=\"3450\" data-end=\"3477\"\u003eMEMS and sensor devices\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Toki Automation","offers":[{"title":"Default Title","offer_id":47082095116457,"sku":null,"price":0.0,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0467\/8660\/9318\/files\/CloseupofLaserSolderBallJetting.png?v=1778640794","url":"https:\/\/www.tokiautomation.com\/products\/laser-solder-ball-jetting-system-laser-tin-ball","provider":"Toki Automation","version":"1.0","type":"link"}