What is laser depaneling?
Lase Depaneling is the act of separating printed circuit boards (PCBs) out of the panel via a laser source.
With traditional depaneling methods, assembled PCBs are cut out of the panel, or de-paneled, using a mechanical separation process. In the case of Laser Depaneling, the depanelization process is performed using a focused laser beam that ablates the material layer by layer. The laser process offers considerable advantages over conventional mechanical cutting processes.
Methods of Depaneling
| Laser Depaneling | The panel is cut out without physical contact, with the aid of a laser beam. The cut is made by ablating the material layer by layer. |
| Die-Punching | The printed circuit boards are manufactured with a press or on impact with the use of a cutting tool. |
| Milling | A machining manufacturing process in which the material is removed with rotating cutting heads in paths. |
| Sawing | The assembled PCB is cut out with the use of a circular saw. With this method, only straight contours can be processed. |
Benefits of Laser Depaneling
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HIGH CUTTING EDGE QUALITY LPKF's innovative CleanCut technology enables PCBs to be processed completely free of carbonization. |
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STRESS-FREE Laser is a non-contact method of separation, preventing mechanical stress on the board and damage to sensitive components. |
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DUST-FREE Flow channels within the cutting chamber are considered to ensure optimised dust extraction after laser depaneling. |
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MATERIAL DIVERSITY A wide variety of different substrate materials can be processed with ease by varying the process parameters. |
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DESIGN FREEDOM Customisable and narrow laser beams allows fine and complex structures to be implemented. |
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FLEXIBILITY The laser offers a wide range of other applications, such as drilling, marking or structuring. |
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WEAR-FREE PROCESSING Laser systems compared to mechanical routing systems are contactless, which means no consumable parts will get worn out or require replacement. |
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COST-SAVINGS Laser machines make it possible to cut the full perimeter of PCBs instead of just cutting the break-out tabs, leading to savings of more than 30% of board material. In addition, wear-free processing means no cost is involved with consumables replacement, thus reducing material and operational costs. |