The Regional Standard for Laser Depaneling and Industrial Marking

Toki Automation supports manufacturers with industry-leading laser processing technology. Our specialized systems deliver:

• Laser Depaneling: Stress-free PCB separation for HDI and Flex boards.

• Laser Marking: High-resolution, permanent QR and serial coding for audit-grade traceability.

• Laser Ablation: Precise material removal and surface preparation without chemicals.

Reduce your scrap rates and eliminate tooling costs with the precision of light.