Laser Processing and Marking

Industrial Laser Processing & Precision Marking

High-Stress Component Protection: Stress-Free Laser Depaneling

Traditional mechanical routing and V-cut scoring introduce vibration and mechanical stress that can lead to latent defects in ceramic capacitors and delicate solder joints.

Toki Automation’s Laser Processing Solutions eliminate these risks entirely.

Our high-speed laser depaneling systems provide a non-contact, burr-free finish for high-density PCBA, flexible circuits (FPC), and rigid-flex boards—ensuring maximum yield for your most complex assemblies.

Wavelength Selection: Processing vs. Marking

Matching the laser source to the material absorption rate is critical for clean edges and high-contrast marks.

Application	Laser Depaneling & Cutting	Cold Marking & Ablation	Stencil Cutting & General Purpose Marking
Laser Source	UV (355nm) / Green (532nm)	UV (355nm)	Fiber (1064nm) / CO2
Best For	PCB Depaneling, FPC Cutting	IC Chip Marking, Day/Night Keys	Metals, Plastics, Packaging
Key Advantage	Zero mechanical stress; <20μm kerf	No heat-affected zone (HAZ)	High speed & permanent
Material Focus	FR4, Polyimide, Ceramics	Silicon, Glass, Polymers	Steel, Aluminum, Acrylic

Toki Automation provides Regional Engineering Support. We ensure your line keeps moving with service engineers located directly in Singapore, Malaysia, Thailand, Philippines, and Indonesia.

We also have a partner service network in Vietnam, India, Germany, and Italy.