Precision Laser & Advanced Manufacturing

As laser specialists, Toki Automation delivers high-accuracy laser solutions for applications requiring minimal thermal impact and ultra-tight, high accuracy process control. Designed for advanced electronics and high-value components, our laser systems enable consistent, contactless processing across complex geometries and sensitive substrates.

Our Core Capabilities:

• Precision Laser Soldering and Reballing: Toki supports Wire, Paste, Preform (Ring) and Solder Ball laser soldering. Laser energy in IR wavelength (~1064nm) is used for localized heating. This is the gold standard for soldering fine-pitch components and BGA reballing while protecting surrounding heat-sensitive areas. Find out more about our automated soldering solutions here.

• Laser Processing and Marking: High-precision systems for cutting, structuring, and permanent identification. Utilizing focused laser energy (including 355nm and 532nm options) to ensure clean edges and minimal material stress across diverse substrates using optimized beam delivery.

• Laser Plastic Welding: Adhesive-free joining process using controlled laser energy in the IR wavelength range to achieve strong, hermetic seals. This method eliminates mechanical stress and surface damage, ideal for medical and automotive sensors.

• Multi-Material Laser Additive Manufacturing: In partnership with Schaeffler (Omnifusion 3D), we provide advanced additive processes to build complex, multi-material structures with high precision for specialized prototyping and production.

From micro-scale processing to complex joining, all laser solutions are validated through Proof of Concept (POC) at our Singapore HQ to ensure process feasibility before full-scale deployment.

We ensure your line keeps moving with service engineers located directly in Singapore, Malaysia, Thailand, Philippines, and Indonesia. We also have a partner service network in Vietnam, India, Germany, and Italy.