Laser Solder Paste Soldering System

Key Applications for Laser Solder Paste Soldering

• SMT component soldering (fine-pitch)
• PCB and FPC assemblies
• Optical modules and transceivers
• Consumer electronics (miniaturised components)
• High-density electronic assemblies

Key Advantages of Laser Solder Paste Soldering

Fine-Pitch Precision
Stable soldering for small pads and dense component layouts

Minimal Thermal Exposure
Localised laser heating protects sensitive substrates and nearby components

Closed-Loop Temperature Control
Real-time monitoring ensures consistent solder quality

High Repeatability
Consistent results across high-mix production

Flexible Production Configurations
Supports multi-station setups for increased throughput

Process Overview of Laser Solder Paste Soldering

1. Solder paste deposition
2. Laser heating (controlled reflow)
3. Solder joint formation
4. Cooling and inspection

System Features

• High-precision laser source
• Real-time temperature monitoring
• Closed-loop process control
• Multi-station configuration (optional)
• Vision alignment system (optional)
• Multi-axis motion platform
• MES / traceability integration ready

Flexible Configuration: Standalone or Fully Integrated

The system adapts to your production requirements:

Standalone Workstation
Ideal for prototyping, NPI, and small-batch production

Inline Integration
Connects to automated lines for high-volume SMT production

Customised System
Supports multi-station setups, custom fixtures, and tailored process development

Typical Specifications (Customisable)

Why Laser Solder Paste Soldering

• Localised heating → protects sensitive components
• No full-board reflow → reduced thermal stress
• High precision → ideal for fine-pitch SMT
• Stable process → improved yield and consistency
  

👉 Especially useful for:

• Optical modules
• Miniaturised electronics
• High-density PCB assemblies