Laser Solder Ball Jetting System (Laser Tin Ball)

Key Applications for Laser Solder Ball Jetting

• BGA soldering and reballing
• Wafer-level packaging
• Semiconductor device interconnections
• Sensor and MEMS packaging
• Advanced packaging (2.5D / 3D)

Key Advantages of Laser Solder Ball Jetting System

Micro-Scale Precision
Handles solder ball sizes from ~70 µm and above for fine-pitch applications

Non-Contact Process
No mechanical force → eliminates risk of component damage

Minimal Thermal Impact
Laser-controlled heating protects surrounding structures

Flux-Free Capability
Clean joints with minimal residue for high-reliability applications

High Consistency
Stable solder ball placement and repeatable joint formation

Process Overview for Laser Solder Ball Soldering

1. Solder ball feeding and positioning
2. Precision ball placement
3. Laser reflow soldering
4. Cooling and inspection

System Features

• Precision solder ball feeding system
• Laser reflow control
• Vision alignment system (optional)
• Closed-loop temperature control
• High-precision motion platform
• Integrated inspection capability
• MES / traceability ready

Flexible Configuration: Standalone or Fully Integrated

The system is designed to scale with your production requirements:

Standalone Workstation
Ideal for R&D, prototyping, and low-volume advanced packaging

Inline Integration
Supports high-volume semiconductor and electronics production lines

Customised System
Configurable for wafer handling, multi-head setups, and specialised applications

Typical Specifications (Customisable)

Why Laser Solder Ball Jetting

• Precise solder volume control
• No contact → no mechanical stress
• Clean process → minimal residue
• High repeatability → semiconductor-grade quality

👉 Especially critical for:

• BGA and fine-pitch packaging
• BGA rework
• Wafer-level processes
• MEMS and sensor devices