Key Applications for Laser Solder Wire Soldering
- PCB / FPC wire soldering
- Motor winding and PCB connections
- Power electronics and inverter modules
- RF antennas, speakers, connectors
- Discrete components and assemblies
Key Advantages of Laser Solder Wire Soldering
Precision Control
Accurate positioning and solder delivery for consistent joints
Minimal Thermal Impact
Laser heating protects sensitive components
Stable Wire Feeding Process
Controlled solder flow for repeatable results
Integrated Inspection Ready
Vision alignment and quality verification
Process Overview for Laser Solder Wire Soldering
- Pad preheating (if necessary)
- Wire feeding and positioning
- Laser solder joint formation
- Cooling and inspection
System Features
- High-precision laser source
- Programmable wire feeding
- Vision alignment (optional)
- Closed-loop temperature control
- Multi-axis motion platform
- Integrated inspection (optional)
- MES / traceability ready
Flexible Configuration: Standalone or Fully Integrated
The system is designed to scale with your production needs:
Standalone Workstation
Compact setup for prototyping, NPI, and low-volume production
Inline Integration
Integrates with conveyors, robotics, and MES for mass production
Customised System
Configurable tooling, fixtures, and multi-station setups for specific applications
Typical Specifications (Customisable)
Performance Parameters |
Specification |
|---|---|
| Wire Types | A variety can be used. |
| Wire Diameter | Application dependent. 0.5-0.6mm diameter and above. Smaller solder wires to be tested. |
| Positioning Accuracy | ±10 µm (typ.) |
| Repeatability | ±5 µm (typ.) |
| Control | Closed-loop temperature |
| Integration | Standalone / Inline |
| Inspection | Optional vision system |
Why Laser Wire Soldering
- Non-contact → no pad damage
- Controlled heat → reduced thermal stress
- Automated → consistent quality
- Integrated inspection → lower defects