Specifications
| Category | Parameter | Specification |
|---|---|---|
| Core Equipment | System Type | Laser Soldering Platform (Multi-process) |
| Soldering Modes | Wire / Paste / Ring (Preform) | |
| Heating Method | Non-contact laser heating | |
| Process Type | Selective, localized soldering | |
| Automation Level | Fully programmable, multi-axis system | |
| Laser & Process | Laser Type | Industrial diode / fibre laser |
| Heating Mode | Direct localized heating | |
| Thermal Impact | Minimal heat spread (low thermal budget) | |
| Process Control | Closed-loop capable | |
| Multi-Feeding System | Wire Feeder | Continuous solder wire delivery for consistent joints |
| Paste Dispenser | Precision dispensing for fine-pitch / micro soldering | |
| Ring (Preform) | Fixed-volume soldering for high-reliability joints | |
| Motion & Automation | Axis System | Multi-axis (3–5 axis) |
| Movement | CNC / robotic motion control | |
| Positioning | High precision programmable | |
| Machine Type | Compact, bench-top system | |
| Vision & Alignment | Vision System | Integrated camera alignment |
| Function | Pad recognition and positioning | |
| Capability | Enables fine-pitch and micro soldering | |
| Machine Dimensions | Width | 660 mm |
| Depth | 760 mm | |
| Height | 1210 mm | |
| Process Capabilities | Functions | Selective Soldering / Fluxless Processing / Fine Pitch Capability / Rework Functionality |
| Key Advantages | Benefits | Localized Heating / Multi-Process Flexibility / Low Thermal Impact / High Precision |