Decotron® 239

Water-based cleaning fluid with good evaporation determined to remove process residues (dust, grease) from aluminium parts and plastics. Also effective for cleaning of a solder paste and uncured epoxy based SMT adhesives from printing stencils, PCBs misprints and squeeges. Ready-mix, intended for direct use. Intended for use mainly in the high-pressure spray-in-air cleaning machines. 

• Designed for special applications in clean room environment
  
• One phase, pH neutral fluid
  
• Fast evaporation rate, does not leave residues on the surface after drying
  
• Recommended for use as a rinsing fluid where fast drying is needed
  
• No flash point, can be heated to increase the cleaning efficiency
  
• Environment-friendly, biodegradable
  
• Excellent compatibility with broad materials, plastics, aluminium, inks and labels 

Cleaning parameters

• Dust particles, grease 
• Solder paste, uncured epoxy based SMT adhesive 

Recommended technology

• Spray-in-air 

Process

Specification