Case Study: STENCIL-FREE PRECISION UNLEASHED: Mastering 200mm BGA Scaling

How a Singapore Semiconductor Manufacturer Scaled Large BGA Reballing up to 200 mm Using Toki Laser Reballing 

Customer Profile 

• Industry: Semiconductor manufacturing  
  
• Location: Singapore 
  
• Application: Large-format processor BGA reballing and rework
• Package Size: 120 mm and above (scalable to 200 mm)  
  
• Ball Size: 0.25–0.75 mm 
• Environment: High-value, high-mix production with strict quality control 

The site supports high-performance processor packages used in enterprise and data center applications, where scrap risk is unacceptable.  

The Challenge 

As BGA sizes increased beyond 120 mm, the site faced growing risk in:  

• Maintaining placement accuracy across very large arrays 
• Managing thermal stability during rework 
• Scaling toward future 200 mm packages
• Supporting high-mix programs without tooling bottlenecks 
  

Conventional stencil-based reballing was evaluated but not preferred due to: 

• Stencil lead time dependency 
• Tooling inventory management 
• Flux handling variability 
• Limited flexibility for engineering changes 
  

The requirement was clear: 

Precision, scalability, and flexibility without tooling dependency.  

The Solution Implemented 

Toki deployed a laser reballing and large-format rework cell capable of:  

• Supporting BGA sizes up to 200 mm  
• Handling 0.25–0.75 mm solder balls 
• Pad-by-pad programmable placement 
• Multi-zone controlled thermal rework 
• Recipe save/load with profile logging 

Laser reballing was selected exclusively to eliminate stencil dependency and improve process flexibility. 

Results & Strategic Impact 

While specific data remains confidential, operational outcomes included: 

• Stable reballing capability for 120 mm+ packages 
• Scalability toward 200 mm device roadmap
• Elimination of stencil procurement delays 
• Improved placement consistency for high-value devices 
• Reduced process variability linked to flux handling 
• Faster new package introduction cycles 

Strategically, the site gained: 

• Size scalability 
• Mix flexibility 
• Reduced scrap exposure 
• Local technical support assurance 

Laser reballing aligned with their high-value, high-mix manufacturing model. 

Customer Testimony 

“Laser reballing provides the precision and flexibility required for our large-format, high-value packages. Eliminating stencil dependency supports our high-mix environment, and local technical support was an important factor.” 

Request a Process Evaluation 

If you are managing:  

• 120 mm+ BGA packages 
• 0.25–0.75 mm solder balls 
• High-value semiconductor devices 
• Scalability toward 200 mm 
  

Speak to a Toki automation specialist to assess laser reballing feasibility and large-format rework stability. 

Related Products:

• Laser Reballing