100% Alcohol-based cleaning fluid determined to remove residues of a solder paste and SMT adhesives from printing stencils, PCBs misprints and squeegees. Specially designed for wet cleaning process in screen printing. Effective for all types of solder pastes and most types of SMT adhesives. Ready-mix, intended for direct use.
High cleaning efficiency / fast evaporation
High compatibility with material and components of the screen printers
EKRA approved cleaning fluid
Tenzide-free, no solid residues on the cleaned surface
Cleaning parameters
Solder paste (unsoldered) : Wet cleaning process in screen printers
SMT adhesive (uncured) : Manual removing using cleaning fluid and a wipe
Process
Cleaning Technology
1. RINSE
2. RINSE
DRYING
Screen printing
X
X
Vacuum, Paper roll
Specification
Appearance
One-phase clear liquid
Color
Colourless / yellowish
Odor
Ether-like
VOC Content
100 %
Recommended process temperature
Room temperature
Flash point
40 °C
Density at 20 °C
0.90 kg/l
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