Decotron® 250

Water-based cleaning fluid determined to remove residues of a solder paste from printing stencils, PCBs misprints and squeegees. Ready-mix, intended for direct use. Effective for all types of solder pastes and most types of SMT adhesives. Intended for use in all types of cleaning machines, mainly in the high-pressure spray-in-air cleaning machines. Suitable to use cleaning machines without rinsing loop.

• Recommended for use in systems with closed cleaning processes and mechanical filtration
  
• pH neutral fluid, rinse in not needed, only recommended
  
• Eliminates potentional foaming of DI water during the rinsing process of the cleaning machine
  
• High compatibility with material and components of the cleaning devices
  
• Environment-friendly, biodegradable
  
• Tenzide-free, no solid residues on the cleaned surface
  
• No flash point, can be heated to increase the cleaning efficiency

Cleaning parameters

• Solder paste (unsoldered)

Recommended technology

• High-pressure spray-in-air

Process

Specification