Decotron® CP381
Water-based cleaning fluid determined to clean misprints and remove flux residues from PCBs after the soldering process. Ready-mix, intended for direct use. Intended for use in all types of DCT cleaning machines, mainly in high-pressure spray-in-air cleaning machines.
- Recommended for use in systems with closed cleaning processes and mechanical filtration
- The fluid is alkaline, rinse with DI water needed
- Eliminates potentional foaming of DI water during the rinsing process of the cleaning machine
- Suitable for cleaning of flux residues of clean and no-clean lead and lead-free solder pastes
- No flash point, can be heated to increase the cleaning efficiency
- Environment-friendly, biodegradable
- Tenzide-free
Cleaning parameters
- Solder paste (soldered)
- Flux wave, selective soldering, manual soldering (soldered)
- Solder paste – PCBs misprints (unsoldered)
Recommended technology
Process
| Cleaning Technology | 1. RINSE | 2. RINSE | DRYING |
| High-pressure spray-in-air |
DI water |
DI water |
Hot air |
Specification
| Appearance | Two-phase yellow-brown liquid/emulsion |
| pH Value | 10 - 11 |
| Odor | weak etheric |
| VOC Content | 20 % |
| Ready-mix Concentration | 22 % |
| Available in Concentrate | Yes |
| Concentration Check (CVA) | Yes |
| Flash point | Non-flammable |
| Density at 20 °C | 0.99 kg/l |