Decotron® T300SA
Water-based cleaning fluid determined for maintenance cleaning of flux residues from soldering frames, pallets and masks and parts of reflow ovens and wave soldering machines. Extra strong ready-mix intended for heavily polluted parts. Additive against oxidation of aluminium.
- Recommended for use in systems with closed cleaning processes and mechanical filtration
- The fluid is alkaline, rinse with DI water needed
- Two phase cleaning fluid with foam control ability during cleaning
- Contains additives against oxidation of the aluminium
- No flash point, can be heated to increase the cleaning efficiency
- Suitable for cleaning of flux residues of clean and no-clean lead and lead-free solder pastes
- Forms stable milky emulsion with high cleaning efficiency when used in spray-in-air cleaning machines
Cleaning parameters
- Flux from soldering frames
- Cleaning filters, heat exchangers and other parts of reflow ovens and wave soldering machines
Recommended technology
Process
| Cleaning Technology | 1. RINSE | 2. RINSE | DRYING |
| High-pressure spray-in-air / Air-bubbling |
DI water, 20 – 30 °C, 5 – 10 min |
Hot air, 50 – 80 °C, > 15 min |
Specification
| Appearance | Two-phase liquid / emulsion |
| Colour | Colourless / white / yellowish |
| Odor | Weak amine |
| pH Value | 11 - 12 |
| VOC Content | 21 % |
| Ready-mix concentration | 22 % |
| Flash point | Non-flammable |
| Density at 25 °C | 1.0 kg/l |