Product Features:

• High-precision 3D imaging technology with strong anti-interference technology
  
• High-precision restoration of IC component lead height reduces occurrence of omission and misjudgments
  
• Small-angle 4-way projection system to eliminate small spacing occlusion
  
• 12 million pixel high-resolution industrial camera
  
• High-speed CoaXPress transmission method, increases the detection speed by 40% compared with the traditional Camera Link
  
• Standard Z-axis module - can perform large-scale bending board compensation
  
• Multi-angled light source combined with highresolution camera and telecentric lens greatly improves detection effect
  
• Offline programming and debugging without occupying equipment inspection time.

Types of Detectable Defects

• Billboard
  
• Solder Short/Bridging
  
• Excess Components
  
• Excess Solder
  
• Insufficient Solder
  
• Missing Solder
  
• Missing Components
  
• Tomb-stoning
  
• Breakage
  
• Offset
  
• Overturn
  
• Foreign Material
  
• Poor Solder Joint
  
• Solder Balls
  
• Oxidation Pollution
  
• Scratches

A.I. Inspection

• Pre-oven Tin Balls
  
• Gold Surface Scratches
  
• Gold Surface Contamination
  
• Tin Adhesion
  
• Tin Balls
  
• Foreign Objects

Specifications